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The Linux kernel configuration item CONFIG_COMEDI_BOND has multiple definitions:
drivers/comedi/KconfigThe configuration item CONFIG_COMEDI_BOND:
(none)comedi_bond, comedi_bondEnable support for a driver to 'bond' (merge) multiple subdevices from multiple devices together as one.
Currently, it only handles digital I/O subdevices.
To compile this driver as a module, choose M here: the module will be called comedi_bond.
drivers/staging/comedi/KconfigThe configuration item CONFIG_COMEDI_BOND:
(none)comedi_bond, comedi_bondEnable support for a driver to 'bond' (merge) multiple subdevices from multiple devices together as one.
Currently, it only handles digital I/O subdevices.
To compile this driver as a module, choose M here: the module will be called comedi_bond.
drivers/staging/comedi/KconfigThe configuration item CONFIG_COMEDI_BOND:
CONFIG_COMEDI_KCOMEDILIBcomedi_bond, comedi_bondEnable support for a driver to 'bond' (merge) multiple subdevices from multiple devices together as one.
To compile this driver as a module, choose M here: the module will be called comedi_bond.
Raw data from LKDDb:
lkddb module comedi_bond CONFIG_COMEDI_BOND : drivers/comedi/Kconfig : "Comedi device bonding support" # in 5.13–5.19, 6.0–6.17, 6.18-rc+HEADlkddb module comedi_bond CONFIG_COMEDI_BOND : drivers/staging/comedi/Kconfig : "Comedi device bonding support" # in 2.6.35–2.6.39, 3.0–3.19, 4.0–4.20, 5.0–5.12This page is automaticly generated with free (libre, open) software lkddb(see lkddb-sources).
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Automatically generated (in year 2025). See also LKDDb sources on GitLab